Emerging Applications Such As 5g Continue To Emerge, Driving Up The Popularity Of Heat Dissipation Module Industry

With the development of 5G and cloud industry, new applications such as mobile phones, servers, electronic competitions, VR, UAV, automotive and so on are coming out, which makes the heat dissipation demand industry look optimistic, and the popularity and share price of the heat dissipation group led by Shuanghong and Chaozhong are rising.

With the development of smartphones, consumers are increasingly demanding chip specifications. Especially in high-end flagship aircraft, the improvement of picture quality and the demand for 3D lead to the increase of GPU computing and heat dissipation.

Samsung and Japanese mobile phone factories took the lead in using micro-heat pipes to improve heat dissipation efficiency. Especially competitive mobile phones have higher demand for heat dissipation and higher specifications of heat pipes. Heating manufacturers disclose that the price of heat dissipation schemes used by competitive mobile phones is several times that of ordinary mobile phones.

The heat sink manufacturer said that in the future 5G will consume more than 9 watts of power due to its fast transmission and short-term high energy consumption, nearly three times as much as the current mobile phone, so the heat sink problem is more important.

The market is optimistic about the expansion of the industrial application space of the heat dissipation community in the future. Share prices of Chaozhong, Shuanghong, Xiexi, Qiyun and Taishuo have risen strongly, and insiders have also increased their weights to become the most popular ethnic group in recent days.

Liu Kunxi, chairman of Xinguang Investment Credit, said that under the development of 5G industry and artificial intelligence in the future, related technology products should meet the energy consumption needs and need high-end heat dissipation module to match components.

Domestic mobile phone manufacturers have begun to deploy new technologies on heat dissipation, such as graphene, air-cooled heat dissipation technology, glorious liquid-cooled heat dissipation technology and so on. With the gradual emergence of 5G, AR and other applications, chips will be loaded for a long time, which is undoubtedly the basis of ensuring their performance.